Press Releases

Innovations in IoT will prevail, despite the difficult economic climate

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The digital boom of the pandemic and new working practices have created a major increase in smart device usage. Yet this increase is tempered by supply chain issues and economic woes due to climate change and the war in Ukraine, says Shahed Mazumder, global director of telco solutions at Aerospike.

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Sophos endpoint security advances aim to improve cyberthreat defences, streamline management

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Oxford, U.K. 9 March 2023 – Sophos, a global provider of cybersecurity as a service, has introduced advances in its portfolio of endpoint security offerings. New adaptive active adversary protection; Linux malware protection enhancements; account health check capabilities; an integrated zero trust network access (ZTNA) agent for Windows and macOS devices; and more improve frontline defences against advanced cyberthreats and streamline endpoint security management. (more…)

Nokia announces its Wi-Fi 6E gateway Beacon 10 at Mobile World Congress

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Nokia has launched the Beacon 10, its gateway supporting Wi-Fi 6E to provide high-capacity mesh networking. The Beacon 10 is a true tri-band device which can provide Wi-Fi throughput of 10Gbps. It includes a 10G WAN interface to pair with 10 Gb/second fiber modems for multi-gigabit services to the home. The new gateway is shown at Mobile World Congress, Barcelona. (more…)

Open XR Forum gains momentum with Hisense Broadband, Lumentum, KDDI and Viettel

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Open XR Forum has announced that Hisense Broadband, KDDI, Lumentum and Viettel have joined the industry initiative to advance the deployment of software-configurable point-to-point and point-to-multipoint coherent optical networks utilising industry-defined XR optics pluggable transceiver technology. (more…)

Infineon’s SECORA connect can make anything a wallet, new technologies will make contactless payment easier in the future

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Making payments at the beach or while playing sports will become increasingly convenient in the future, as more and more everyday objects such as watches, rings, key fobs and even items of clothing gain the ability to conduct payment transactions. As the market provider of security semiconductors, Infineon Technologies AG is now driving this development forward with its SECORA Connect portfolio. New chips whose smallest versions are less than half the size of ladybugs open up possibilities for manufacturers to turn even small everyday objects into contactless means of payment.

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Sonde Health, MassGen selected for MassAITC pilot study to examine use of voice in remote detection

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Sonde Health, a health technology company committed to bringing accessible health monitoring to everyone, in conjunction with the Massachusetts General Hospital (MGH) Frontotemporal Disorders (FTD) Unit. The MGH has been selected by the Massachusetts Artificial Intelligence and Technology Centre for Connected Care in Aging & Alzheimer’s Disease (MassAITC) to lead a pilot study focused on leveraging vocal biomarkers for remote detection and monitoring of mild cognitive impairment in the home environment. (more…)

Semtech, The Things Industries collaborate to bring LoRaWAN, cellular solutions to market

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Semtech Corporation, a high-performance semiconductor, IoT systems and cloud connectivity service provider, has announced it is collaborating with partners including The Things Industries on new solutions. They combine cellular and LoRaWAN technologies to enable more IoT use cases, faster adoption, easier integration and quicker time-to-market (more…)

Telit Cinterion expands 5G LPWA module portfolio with new modules featuring Sony’s altair ALT1350 chipset

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Telit Cinterion, a global provider of the intelligent edge, has announced new ultra-compact 5G low-power wide area (LPWA) modules for a wide variety of indoor and outdoor IoT applications that require long battery life and long service life. The modules feature the ALT1350 chipset from Sony Semiconductor Israel (Sony), a chipset that supports both unlicensed spectrum and satellite connectivity in a single chipset, enabling faster development, lower power, smaller size and new use cases. (more…)

Rohde & Schwarz, Broadcom extend test collaboration for latest Wi-Fi 7 access point chipsets

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Rohde & Schwarz and Broadcom have validated the R&S CMP180 radio communication tester for production testing of the latest Broadcom Wi-Fi 7 access point chipsets. A Wi-Fi 7 test setup with the R&S CMP180 and a Broadcom Wi-Fi 7 device will be demonstrated at the Rohde & Schwarz booth at the Mobile World Congress 2023 in Barcelona. (more…)

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