Press Releases

Close-up of SIM cards and eSIM chip components on a flat surface, representing eUICC hardware used in SGP.32 IoT eSIM provisioning

COMPRION works with STMicroelectronics to provide reference environment for SGP.32 IPAd testing

COMPRION and STMicroelectronics have jointly validated an end-to-end test environment for IoT Profile Assistant (IPAd) implementations under the GSMA SGP.32 specification.

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September 15, 2026

Posted by: Marion Webber

IoT Global Awards banner

Two days left: The 2026 IoT Global Awards programme closes for entries this Friday

The IoT Global Awards will stop accepting entries for this year’s programme, at 17:00 CET on Friday 11th September.

Entries are to be submitted via the official IoT Global Awards site and the shortlist of entries will be announced on Wednesday 16th September. The winners will be announced on Wednesday 7th October.

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September 8, 2026

Posted by: Marion Webber

Gigadevice logo

GigaDevice joins the Zephyr Project to foster global open-source ecosystem

GigaDevice, a semiconductor company specialising in Flash memory32-bit microcontrollers (MCUs)sensors and analogue productshas officially joined the Zephyr Project, one of the world’s open-source real-time operating systems (RTOS). Hosted by the Linux Foundation, the Zephyr Project welcomes GigaDevice as a Silver Member, making GigaDevice a dual Silver Member of both the Zephyr Project and the Linux Foundation. Using its comprehensive GD32 MCU portfolio, GigaDevice will actively participate in the Zephyr community, promoting deeper integration between its MCU technologies and the global open-source RTOS ecosystem. This will provide customers and developers in industrial, IoT, consumer electronics and other fields with a more open, standardised and efficient embedded development environment, while continuing to contribute to the growth of the global embedded open ecosystem and broader access to technology.

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Posted by: Marion Webber

The nRF93M1 smart modem

Nordic Semiconductor takes the nRF93M1 smart modem global

Nordic Semiconductor, a global contributor in low-power wireless connectivity solutions, has announced that its multi-regional nRF93M1-LABA smart modem module, introduced at Mobile World Congress in March 2026, has reached general availability with Global Certification Forum (GCF) compliance, alongside the start of sampling for the nRF93M1-LACA, a pin-, and software-compatible global-band variant. Together, they give developers a faster path to deploying Cat 1 bis connected devices across global markets without redesigning their hardware for each region.

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August 25, 2026

Posted by: Marion Webber

S9 DECT NR Gateway Production Hall lowres

STRATUM 9 brings deterministic wireless connectivity to industrial automation with DECT NR+

Industrial wireless communication has long meant choosing between reliability and freedom. STRATUM 9‘s DECT NR+ Gateway – built on Nordic‘s nRF9151 module – delivers both, guaranteeing real-time wireless control over a private, license-free band, with no carrier dependency.

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August 18, 2026

Posted by: Marion Webber

nRF9151 with Skylo, LooUQ and Remsight

Nordic’s nRF9151 opens satellite and cellular IoT to a new class of connected devices

Nordic Semiconductor, a global contributor in low-power wireless connectivity solutions, has announced a faster path to satellite and cellular IoT. Embedded modem innovator LooUQ‘s MTC2-N9151 has earned Skylo Non-Terrestrial Network (NTN) certification, building on Nordic’s own Skylo-certified nRF9151 to reduce time-to-market for IoT product developers.
Water technology company Remsight is already deploying the compact, drop-in embedded modem from LooUQ to monitor water infrastructure across the American West, reaching the field much faster and at lower cost than it would have building their own solution from scratch.

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August 11, 2026

Posted by: Marion Webber

New LoRa Alliance standards Make LoRaWAN deployments faster, simpler and more scalable

The LoRa Alliance, the open, non-profit organisation defining, evolving and promoting the LoRaWAN standard, has took a significant step in achieving effortless, low-touch deployment at scale with new specifications that enable automated device set-up and a new technical document that extends LoRaWAN’s connectivity reach.

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August 6, 2026

Posted by: Marion Webber

A Wi-Fi chip

Quectel’s FGH200M Wi-Fi HaLow module now FCC/IC/CE/RCM certified for mass production

Morse Micro, one of the world’s Wi-Fi HaLow silicon provider, has announced that Quectel’s FGH200M module has passed FCC/IC/CE/RCM certification. Built on Morse Micro’s MM8108 system-on-chip, the module is now cleared for mass-market production, giving IoT device makers a validated path to Wi-Fi HaLow at scale.

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August 4, 2026

Posted by: Marion Webber

Cyware and Armis press release title with the company logos

Cyware announces partnership with Armis from ServiceNow to deliver asset-centric threat context

Cyware, a contributor in agentic AI-powered threat intelligence operationalisation, has announced a partnership with Armis from ServiceNow, a global contributor in cyber exposure management and security, to deliver asset-centric threat intelligence operationalisation. The collaboration combines Armis’ real-time asset visibility with Cyware’s advanced threat contextualisation capabilities. This empowers security teams to map global threat intelligence directly onto their unique asset landscapes, moving organisations from reactive firefighting to proactive, automated defence.

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July 30, 2026

Posted by: Marion Webber

A man sitting with headphones on listening to something on his phone

SEALSQ and L5 Cartronics partner to develop secure multi-package IoT modules

SEALSQ, a developer of semiconductor, PKI and provisioning technologies, and L5 Cartronics (LFC), an Indian electronics design and manufacturing company, has announced a partnership to develop a new generation of highly competitive secure connectivity modules for IoT applications.

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July 21, 2026

Posted by: Marion Webber