Semtech, a semiconductor, Internet of Things (IoT) systems, and cloud connectivity service provider, has announced the certification of the HL7900 Global 5G LPWA module by three United States (U.S.) carriers – AT&T, T-Mobile and Verizon – as well as KDDI in Japan.
January 22, 2025
Posted by: Marion Webber
Lantronix, a company in Internet of Things (IoT) compute and connectivity IoT solutions, has announced the appointment of Daniel Quant as head of the Industrial IoT (IIoT) Products and Business Line at Lantronix. Reporting directly to Lantronix’s chief strategy officer Mathi Gurusamy, Quant will play a role in driving Lantronix’s vision of integrating Artificial Intelligence into Industrial IoT devices to meet the increasing demand for Edge Intelligence in industrial and enterprise environments.
January 16, 2025
Posted by: Marion Webber
Nordic Semiconductor and Kigen have announced a technical collaboration that will accelerate Massive IoT deployments. The partnership combines Kigen eSIMs, Kigen’s eSIM IoT Remote Manager (eIM) solution for SGP.32 IoT eSIMs and Nordic’s award-winning nRF9151 System-in-Package (SiP). The collaboration underscores both companies’ commitment to offer robust, secure, low-power cellular IoT solutions that remove the technical barriers to wireless connectivity and enable rapid scalability of the IoT.
Nordic and Kigen will showcase their innovations at CES 2025, offering visitors demonstrations and in-depth discussions with their engineering teams. CES will be held in Las Vegas, NV, from 7 to 10 January 2025. Nordic can be found on booth #52039 at the Venetian Expo.
“The joint testing between Kigen eIM solution and Nordic Semiconductor’s nRF9151 reflects our shared commitment to innovation in low-power, compact, and battery-efficient IoT devices,” said Vincent Korstanje, the CEO, Kigen. “At Kigen, this is part of our vision to ensure that standards bring benefits to the broadest set of players – making this transformative technology accessible, cost-effective, and scalable for businesses of all sizes.”
Oyvind Birkenes, the EVP business unit long-range at Nordic Semiconductor, said, “The collaboration with Kigen has produced an outcome that’s much more than just an important technical milestone. Rather, the simplicity brought by Kigen’s solution combined with the highly integrated, low power and cost-efficient nRF9151 SiP has the potential to transform the cellular IoT landscape by making it easier and faster for all sizes of companies to deploy Massive IoT applications.”
December 23, 2024
Posted by: Magda Dabrowska
Silicon Labs has announced that they have shipped four million FG23 SoCs for smart electricity meters as part of India’s Advanced Metering Initiative (AMI). (more…)
December 6, 2024
Posted by: Magda Dabrowska
The Wireless Broadband Alliance (WBA) has released an updated “Operator Managed Wi-Fi (OMWi): Reference Architecture and Requirements” technical report. This update includes enhanced technical and operational requirements and introduces open-source, OMWi-compliant implementations from partners such as the prpl Foundation and RDK-B. It delivers a comprehensive framework for deploying and managing residential Wi-Fi, addressing global operator needs through the integration of key standards and open-source platforms. (more…)
December 4, 2024
Posted by: Magda Dabrowska
Veea has partnered with Mainstream Fiber Networks, Microclimates and AmeriCrew LLC to deploy Climate Smart Agriculture solutions at Cyr Farm in Fowler, Indiana. The installation of the Veea’s Edge Platform’s connectivity technology is aimed at improving resource management, sustainability and productivity in farming operations. (more…)
December 3, 2024
Posted by: Magda Dabrowska
Ezurio (formerly Laird Connectivity), has released a family of Bluetooth LE modules based on Nordic Semiconductor’s new next generation of low power wireless SoC, the nRF54L15. The modules enable wireless product designers to bring new products to market faster, while delivering the highest level of performance, security and efficiency with ultra-low power consumption. The modules are predominantly designed for industrial, medical and commercial applications.
The ‘BL54L15 Series’ utilises the QFN48 package of Nordic’s nRF54L15 SoC. It features 31 GPIOs and comprises two module variants, that have either an integrated PCB trace antenna or a MHF4 connector on board. Both modules come in a 14 by 10 mm form factor.
The ‘BL54L15µ Series’ utilises the WSCLP package of the nRF54L15 SoC. It features 32 GPIOs and comprises two module variants that have either an integrated chip antenna or a trace pad for external antenna support. The modules come in a highly compact 6.3 by 7.9 mm form factor.
Each series of modules is optimised for high-performance applications, ensuring secure, robust and efficient wireless communication with support for the latest Bluetooth standards and secure programming options.
“The Bl54L15 and BL54L15µ module variants bring out the full capability of the market-leading, underlying Nordic silicon for the end customer to utilize in a fully pre-certified solution,” said Jonathan Kaye, the VP of product management and marketing at Ezurio. “The plethora of protocols and application support in a single hardware/software solution enables us to support the widest possible set of use cases and customer requirements for short range wireless connectivity.”
November 15, 2024
Posted by: Magda Dabrowska
Quectel Wireless Solutions and TÜV SÜD have announced that the Quectel EG91-EX LTE Cat 1 module has been awarded the EU Type Examination Certificate for RED Cybersecurity. This certification confirms that the module complies with the cybersecurity requirements outlined in RED DA, providing Quectel customers with assurance in the module’s robust cybersecurity features. (more…)
October 24, 2024
Posted by: Magda Dabrowska
SolarEdge Technologies has announced that its portfolio of PV inverters has achieved early certification and compliance with the European Commission’s New Radio Equipment Directive (RED) Article 3.3 requirements for cyber security. (more…)
October 22, 2024
Posted by: Magda Dabrowska
Silicon Labs in partnership with Kudelski IoT has announced a new solution to accelerate the time to market for Matter-certified IoT devices. The collaboration integrates Kudelski IoT’s Matter Device Attestation Certificates (DAC) into Silicon Labs’ Custom Part Manufacturing Service (CPMS), enabling device makers to build Zero Trust security from the foundry to customers’ doorsteps, which ultimately saves time and costs. (more…)
October 11, 2024
Posted by: Magda Dabrowska