TE Connectivity’s new Sliver straddle-mount connectors enable a faceplate-pluggable OCP NIC 3.0
TE Connectivity’s Open Compute Project (OCP)
NIC 3.0. Picture Credits – PR Newswire
TE Connectivity (TE), a provider of innovative connectivity solutions for high-speed computing and networking applications, introduced its new Sliver straddle-mount connectors, which are the new standard form factor supporting a faceplate-pluggable Open Compute Project (OCP) NIC 3.0. A new extension of the Sliver product line, these straddle-mount connectors were designed to be useful for OCP NIC 3.0 cards in a low profile for ease of system maintenance and improved thermal management.
Sliver straddle-mount connectors for SFF-TA-1002 support high speeds through PCIe Gen 5, with a roadmap to 112G. SFF-TA-1002 is a proposed alternative or replacement to many form factors, including M.2, U.2, and PCIe. The high-density, 0.6mm pitch of the Sliver straddle-mount connectors also supports next-gen silicon PCIe lane counts, which is where current products in the market begin to max out.
OCP NIC 3.0 cards are horizontal and faceplate-pluggable, which helps to increase airflow through the enclosure and enable system ease of design. TE’s Sliver straddle-mount products are among the most cost-effective and highest performing solutions on the market.
“OCP-compliant designs are taking the data centre equipment industry by storm, and TE Connectivity is a major supplier of connectors for these designs,” said Ann Ou, product manager at TE Connectivity. “Our Sliver straddle-mount products deliver high performance and density in a standardised form factor to facilitate design and manufacturing for our data centre equipment partners.”
To learn more about TE’s Sliver straddle-mount connectors, click here.
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