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Viettel enters AI collaboration with NVIDIA

Hanoi, Vietnam – Viettel Group and NVIDIA signed a Memorandum of Understanding (MoU) to establish a strategic partnership on using Artificial Intelligence (AI) to advance Viettel and Vietnam’s technology research and solutions. (more…)

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July 5, 2022

Posted by: Shriya Raban

Elliptic Labs launches with Xiaomi on Xiaomi 12S ultra and 12 pro smartphones for China market

OSLO, Norway. 5 July 2022 – Elliptic Labs, a global AI software company and the world specialist in AI Virtual Smart Sensors, has launched its AI Virtual Proximity Sensor INNER BEAUTY on the Xiaomi 12S Ultra and Xiaomi 12 Pro the latest flagship smartphones from Xiaomi, the smartphone OEM. Both phones are targeted for the China market. (more…)

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Posted by: Shriya Raban

IoT home devices are getting a new standard, here’s why it “matters”

The IoT is getting a new standard which could put digital trust and interoperability into smart home devices. It’s called Matter, says Mike Nelson, VP of IoT security, DigiCert.

(more…)

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July 4, 2022

Posted by: Shriya Raban

umlaut launches ‘5G campus lab’, an open RAN private network to speed development of connectivity solutions

Aachen, Germany. 30 June 2022 – umlaut, part of Accenture, has opened a private 5G standalone, Open RAN network in Aachen, Germany. The “5G Campus Lab” enables companies across industries to design, test and implement ultra-high-speed and low-latency connectivity solutions faster without having to invest in building their own network. (more…)

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July 1, 2022

Posted by: Shriya Raban

The power of audio meets the power of virtual desktops: EPOS & 10ZiG announce new partnership

Leicester, United Kingdom – EPOS, a global brand designing high end audio solutions for better communication and collaboration, and 10ZiG, a provider of virtual desktop endpoint hardware and software, have partnered to deliver EPOS audio devices and management software optimised for 10ZiG Windows 10 IoT Thin Client endpoint devices. (more…)

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June 30, 2022

Posted by: Janmesh Chintankar

Siemens launches building X, an open AI-enabled suite for net zero buildings

30 June 2022 – Siemens Smart Infrastructure has launched Building X, a new smart building suite that is open, interoperable and fully cloud-based. The suite is the first next generation offering built on the design principles of Siemens Xcelerator, an open digital business platform launched today to accelerate digital transformation and value creation across industry, transportation, grids and buildings. (more…)

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Posted by: Shriya Raban

Advantech introduces COM-HPC module with ultra-powerful AMD EPYCTM Embedded 7003 server processors

Taipei, Taiwan and Munchen, Germany, 30 June 2022 – Advantech, a provider of embedded computing solutions introduced the COM-HPC Server-on-Module with AMD EPYC 7003 Embedded processors at embedded world 2022. With 64 cores, the new COM-HPC Size E Server-on-Modules (200 x 160 mm) provide more than triple the number of available edge server cores compared to any other COM-HPC server module on the market offering edge server engineers an immense performance leap. (more…)

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Posted by: Shriya Raban

Increasing demand for human-drone collaboration and the maturity of 5G to spur growth in the drone market

The market of small unmanned aerial systems (sUAS), commonly known as drones, continues to grow, and global technology intelligence firm ABI Research predicts total worldwide shipments of sUAS ecosystems to reach 3 million by 2025, increasing at a 25% compound annual growth rate (CAGR). COVID-19 has driven the need for more human-drone collaboration. (more…)

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Posted by: Shriya Raban

Accenture announces Intent to acquire XtremeEDA to expand silicon design capabilities in Canada and US

Toronto and Austin. 27 June 2022 – Accenture has entered into an agreement to acquire XtremeEDA, an Ottawa-based silicon design services provider. The company provides semiconductor engineering services for clients seeking custom silicon solutions used in consumer devices, cloud data centres, machine learning and artificial intelligence (AI) computational platforms to enable edge AI deployment. The terms of the acquisition were not disclosed. (more…)

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Posted by: Shriya Raban

Teledyne FLIR introduces FlexView lens to provide thermographers with two lenses in one

Teledyne FLIR, part of Teledyne Technologies Incorporated, introduced the FlexView dual field of view (DFOV) lens attachment for FLIR Axxx and Txxx series thermography cameras designed to improve operational efficiency, safety, and accuracy from switchyards to the plant floor. (more…)

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June 28, 2022

Posted by: Janmesh Chintankar