According to recent studies conducted by Deloitte, an average number of connected devices in US households has risen to 22. This and other trends are pushing FCC (federal communications commission) to raise previous definition of broadband, 25Mbps (megabits per second), to 100Mbps goal and Airvine describes in a blog post how property owners, management companies and managed service providers in ‘MDU’ (multi-dwelling unit) sector can provide necessary broadband network upgrades within these buildings. (more…)
September 12, 2023
Posted by: Janmesh Chintankar
Marvell Technology, Inc., a provider in data infrastructure semiconductor solutions, has introduced its technology platform for 5nm multi-gigabit copper Ethernet PHYs (physical layer). This platform empowers enterprise network equipment manufacturers and other stakeholders to achieve the energy efficiency and performance goals of upcoming multi-gigabit network technologies like Wi-Fi 7. (more…)
August 23, 2023
Posted by: Janmesh Chintankar
ZTE Corporation, together with True Corporation, Thailand’s telecom-tech company, have jointly launched the True & ZTE Innovation Centre at True Digital Park in Bangkok. The collaboration between True and ZTE will inject new vitality into Thailand’s digital transformation. (more…)
July 7, 2023
Posted by: Janmesh Chintankar
Bangkok, Thailand – The ultra-broadband forum 2022 raised its curtain in Bangkok, with David Wang, Huawei’s executive director of the board and chairman of the ICT infrastructure managing board, delivering a keynote speech titled Stride to ultra-broadband 5.5G. During this speech, Wang outlined the enormous changes that are set to take place in areas like smart homes, smart campuses, and industrial Internet by 2030. He also made it clear that ultra-broadband 5.5G will be a key milestone on the path to an intelligent world and recommended that the industry take four key steps to accelerate this process. He went on to call on all industry players to work together and move faster towards ultra-broadband 5.5G. (more…)
November 2, 2022
Posted by: Janmesh Chintankar
Morse Micro, a provider of Wi-Fi HaLow chips, has announced a partnership with Heltec Automation to accelerate the delivery of Wi-Fi HaLow enabled devices and revolutionise Internet of Things (IoT) connectivity. Heltec Automation has integrated Morse Micro’s MM6108 Wi‑Fi HaLow SoC into a suite of five breakthrough products designed to deliver unprecedented long-range connectivity, high data speeds, and energy-efficient performance.
June 12, 2025
Posted by: Marion Webber
HSB, a specialty insurer and technology provider, has introduced Meshify Defender Slim, its latest and thinnest Internet of Things (IoT) sensor, powered by Amazon Sidewalk to help protect small commercial locations, habitational buildings and residential homes from water leaks and frozen pipes.
May 12, 2025
Posted by: Marion Webber
The LoRa Alliance, the global association of companies backing the open LoRaWAN standard for the internet of things (IoT) low-power wide-area networks (LPWANs), has announced that it will bring together its extensive LoRaWAN ecosystem as part of IoT Solutions World Congress (IOTSWC), taking place May 13–15, 2025, at Barcelona’s Gran Via Venue. Under the banner “Building Massive IoT with LoRaWAN,” the organisation will feature a day-long program dedicated to LoRaWAN on May 14. Beyond the stage talks, members will share insights about their success stories as part of several show floor talks, including those from 19 LoRa Alliance member companies who will demonstrate LoRaWAN in Action! in Hall 8 Stand D9.
May 2, 2025
Posted by: Marion Webber
Nordic Semiconductor, a global contributor in low power wireless connectivity solutions, has announced that its nRF9151 System-in-Package (SiP) module, a low-power integrated LTE-M/NB-IoT and DECT NR+ (NR+) modem solution with GNSS, now supports NR+ 915 MHz band operation. Support for the popular sub-GHz band complements the SiP module’s existing provision for 1.9 GHz global NR+ operation and opens up important new North American smart grid and utility metering applications, among others.
March 21, 2025
Posted by: Marion Webber
Silicon Labs, a contributor in secure, intelligent wireless technology for a more connected world, has announced that its MG26 family of wireless SoCs is now generally available through Silicon Labs and its distribution partners. As the industry’s most advanced, high-performance Matter and concurrent multiprotocol solution to date, the MG26 SoC features double the Flash and RAM of other Silicon Labs multiprotocol devices, advanced artificial intelligence (AI)/machine learning (ML) processing, and best-in-class security to empower developers to design future-proof Matter applications.
February 27, 2025
Posted by: Marion Webber
PHY Wireless, a contributor in innovative cellular location technology, has announced a collaboration with Nordic Semiconductor to integrate its ultra-low-power location technology with Nordic’s nRF9151 system-in-package (SiP) module. This collaboration uses 3GPP-standardised signaling to deliver power-efficient, high-accuracy location solutions worldwide with PHY Wireless’s industry-first on-device observed time difference of arrival (OTDOA) solution.
February 26, 2025
Posted by: Marion Webber