SG Wireless Limited, a full-stack Internet of Things (IoT) technology solutions provider and design engineering subsidiary of Season Group, has announced a key partnership with 1NCE, a global contributor in IoT software and connectivity services. This collaboration integrates 1NCE’s SIM card technology into SG Wireless’ F1 Starter Kits, enabling customers to benefit from seamless, zero-touch provisioning for a true plug-and-go IoT development experience.
August 14, 2025
Posted by: Marion Webber
Morse Micro, a provider of Wi-Fi HaLow chips, has announced a partnership with Heltec Automation to accelerate the delivery of Wi-Fi HaLow enabled devices and revolutionise Internet of Things (IoT) connectivity. Heltec Automation has integrated Morse Micro’s MM6108 Wi‑Fi HaLow SoC into a suite of five breakthrough products designed to deliver unprecedented long-range connectivity, high data speeds, and energy-efficient performance.
June 12, 2025
Posted by: Marion Webber
HSB, a specialty insurer and technology provider, has introduced Meshify Defender Slim, its latest and thinnest Internet of Things (IoT) sensor, powered by Amazon Sidewalk to help protect small commercial locations, habitational buildings and residential homes from water leaks and frozen pipes.
May 12, 2025
Posted by: Marion Webber
The LoRa Alliance, the global association of companies backing the open LoRaWAN standard for the internet of things (IoT) low-power wide-area networks (LPWANs), has announced that it will bring together its extensive LoRaWAN ecosystem as part of IoT Solutions World Congress (IOTSWC), taking place May 13–15, 2025, at Barcelona’s Gran Via Venue. Under the banner “Building Massive IoT with LoRaWAN,” the organisation will feature a day-long program dedicated to LoRaWAN on May 14. Beyond the stage talks, members will share insights about their success stories as part of several show floor talks, including those from 19 LoRa Alliance member companies who will demonstrate LoRaWAN in Action! in Hall 8 Stand D9.
May 2, 2025
Posted by: Marion Webber
Nordic Semiconductor, a global contributor in low power wireless connectivity solutions, has announced that its nRF9151 System-in-Package (SiP) module, a low-power integrated LTE-M/NB-IoT and DECT NR+ (NR+) modem solution with GNSS, now supports NR+ 915 MHz band operation. Support for the popular sub-GHz band complements the SiP module’s existing provision for 1.9 GHz global NR+ operation and opens up important new North American smart grid and utility metering applications, among others.
March 21, 2025
Posted by: Marion Webber
Silicon Labs, a contributor in secure, intelligent wireless technology for a more connected world, has announced that its MG26 family of wireless SoCs is now generally available through Silicon Labs and its distribution partners. As the industry’s most advanced, high-performance Matter and concurrent multiprotocol solution to date, the MG26 SoC features double the Flash and RAM of other Silicon Labs multiprotocol devices, advanced artificial intelligence (AI)/machine learning (ML) processing, and best-in-class security to empower developers to design future-proof Matter applications.
February 27, 2025
Posted by: Marion Webber
PHY Wireless, a contributor in innovative cellular location technology, has announced a collaboration with Nordic Semiconductor to integrate its ultra-low-power location technology with Nordic’s nRF9151 system-in-package (SiP) module. This collaboration uses 3GPP-standardised signaling to deliver power-efficient, high-accuracy location solutions worldwide with PHY Wireless’s industry-first on-device observed time difference of arrival (OTDOA) solution.
February 26, 2025
Posted by: Marion Webber
Murata Manufacturing will showcase a wide range of indoor assets tracking and connectivity solutions at Embedded World (Nuremberg, 11th-13th March 2025). Amongst the wide range of engaging demonstrations, visitors to Murata’s booth (4A-646) will be able to explore how the module Type 1WL EVK and smart badges are used to track indoor assets and people.
February 7, 2025
Posted by: Marion Webber
Silicon Labs, a provider of secure, intelligent wireless technology for a more connected world, introduced the BG22L and BG24L SoCs for Bluetooth LE connectivity, with “L” representing the new application-optimised Lite devices.
January 31, 2025
Posted by: Marion Webber
French embedded systems developer InVirtus Technologies has launched its ‘EosFlex’ and ‘EosFlexMini’ asset tracking devices for ultra-low power locationing using Bluetooth LE wireless connectivity. Powered by Nordic Semiconductor’s nRF52810 SoC, the compact tags measure just 19 by 31 mm, and are easily attachable to key resources using a self-adhesive backing. Equipped with a photovoltaic (PV) ‘solar’ panel, the tags harness energy from the environment to operate efficiently without requiring battery replacements, even in low-light conditions.
January 21, 2025
Posted by: Marion Webber