COMPRION and STMicroelectronics have jointly validated an end-to-end test environment for IoT Profile Assistant (IPAd) implementations under the GSMA SGP.32 specification.
September 15, 2026
Posted by: Marion Webber
Industrial AI, digital twins, cyber security, electrification and advanced automation are moving rapidly from the innovation agenda to operational reality. For UK manufacturers, the challenge is no longer whether these technologies matter, but how to apply them in ways that improve productivity, strengthen resilience and support long-term industrial capability. This shift will be reflected at Advanced Engineering, which returns to NEC Birmingham on 4–5 November 2026, co-located with UK Metals Expo and Lab Innovations.
September 11, 2026
Posted by: Marion Webber
Türkiye’s AI ambitions moved into the global spotlight today as the inaugural GITEX Ai Türkiye 2026 opened at Istanbul Expo Centre, bringing technology leaders, investors, policymakers and startups from Türkiye and around the world together at a pivotal moment for the country’s digital economy.
September 10, 2026
Posted by: Marion Webber
The next phase of Zigbee innovation is here, and it’s built for scale, reach and reliability.
Following the introduction of Zigbee 4.0 and Suzi, the Connectivity Standards Alliance’s new sub-GHz connectivity solution, we are excited to announce the opening of the Product Certification Program for Zigbee sub-GHz (Suzi).
This marks a significant step forward in enabling the industry to bring standardized long-range, low-power, and interoperable IoT products to market, backed by the trusted Zigbee ecosystem.
September 3, 2026
Posted by: Marion Webber
Nordic Semiconductor, a global contributor in low-power wireless connectivity solutions, has announced that its multi-regional nRF93M1-LABA smart modem module, introduced at Mobile World Congress in March 2026, has reached general availability with Global Certification Forum (GCF) compliance, alongside the start of sampling for the nRF93M1-LACA, a pin-, and software-compatible global-band variant. Together, they give developers a faster path to deploying Cat 1 bis connected devices across global markets without redesigning their hardware for each region.
August 25, 2026
Posted by: Marion Webber
SEALSQ, a developer of semiconductor, PKI and provisioning technologies, and L5 Cartronics (LFC), an Indian electronics design and manufacturing company, has announced a partnership to develop a new generation of highly competitive secure connectivity modules for IoT applications.
July 21, 2026
Posted by: Marion Webber
Telit Cinterion, a global Internet of Things (IoT) enabler, has announced a partnership with New Frontier Communications, a Denver-based technology and communications consultancy. This partnership broadens the reach of resilient, enterprise-grade cellular connectivity solutions across the U.S.
May 12, 2026
Posted by: Marion Webber
The Wireless Broadband Alliance (WBA), the global industry body dedicated to driving the seamless and interoperable services experience of Wi-Fi across the global wireless ecosystem, has announced the publication of the “Wi-Fi HaLow for IoT: Japan Field Trials Report”. The report marks the completion of the WBA’s Wi-Fi HaLow Phase 3 field trials in Japan and validates Wi-Fi HaLow (IEEE 802.11ah) as a scalable, long-range connectivity solution for real-world IoT deployments. More importantly, it signals the growing maturity of Wi-Fi HaLow as a powerful wireless foundation for the next generation of connected environments.
April 30, 2026
Posted by: Marion Webber
Shenzhen-based Minew is a Chinese IoT hardware manufacturer specialising in wireless connectivity products, offering complete solutions from conception to production. Founded in 2007, the firm offers a comprehensive product portfolio of Bluetooth Low Energy (LE) beacons, IoT sensors, gateways, asset tags, LoRaWAN devices and wireless modules.
April 28, 2026
Posted by: Marion Webber
The OPC Foundation has announced a new joint working group effort with the LoRa Alliance to develop a mapping from LoRaWAN to OPC UA, bringing together two highly complementary technologies that play important roles in the future of industrial and IoT connectivity. This collaboration aims to define how data and information models originating from LoRaWAN-based devices and systems can be represented in OPC UA, enabling improved interoperability between low-power wide-area network (LPWAN) deployments and industrial automation, enterprise and cloud-based systems.
April 23, 2026
Posted by: Marion Webber