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Infineon’s SECORA connect can make anything a wallet, new technologies will make contactless payment easier in the future

Making payments at the beach or while playing sports will become increasingly convenient in the future, as more and more everyday objects such as watches, rings, key fobs and even items of clothing gain the ability to conduct payment transactions. As the market provider of security semiconductors, Infineon Technologies AG is now driving this development forward with its SECORA Connect portfolio. New chips whose smallest versions are less than half the size of ladybugs open up possibilities for manufacturers to turn even small everyday objects into contactless means of payment.

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March 9, 2023

Posted by: Shriya Raban

Estes selects Samsara’s Connected Operations Cloud to strengthen its customer, employee experience

San Francisco, United States – Samsara Inc., has announced that the Samsara Connected Operations Cloud was selected by Estes Express Lines, a privately-owned freight carrier in North America. Estes leverages Samsara to provide customer and employee experiences while improving the safety, efficiency, and sustainability of its operations. (more…)

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Posted by: Janmesh Chintankar

Huawei launches 50G POL prototype for next-generation Wi-Fi 7 campus networks

Barcelona, Spain – During the Mobile World Congress 2023 (MWC 2023), Huawei launched 50G POL prototype to help industry customers build next-generation Wi-Fi 7 campus networks. (more…)

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Posted by: Janmesh Chintankar

HERE, Cognizant partner to deliver location insights, analytics for global businesses

HERE Technologies, a location data and technology platform, has announced that it has teamed up with Cognizant, a professional services companies, to provide real-time location insights and analytics to Cognizant’s customers across the retail, ride-hailing, logistics, manufacturing and automotive sectors. By leveraging location insights and analytics, businesses will be able to reach and serve their customers more accurately. (more…)

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Posted by: Janmesh Chintankar

Moxa unveils next-generation industrial Wi-Fi access points/clients to futureproof mobile automation

Taipei, Taiwan – Moxa Inc., a provider in industrial communications and networking, introduced a new lineup of next-generation industrial wireless networking solutions, featuring the AWK-3252AAWK-4252A, and AWK-1151C Series AP/bridge/client. The new AWK portfolio offers 802.11ac performance, IEC 62443-4-2 SL2 certified security, and dual-band turbo roaming for wireless reliability and availability. Combined, these features meet the current and future demands of mobile automation and IP surveillance in mining, manufacturing, healthcare, transportation, and many other industries, where autonomous guided vehicles (AGVs) and autonomous mobile robots (AMRs) are at the heart of boosting productivity and operational safety. (more…)

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March 6, 2023

Posted by: Janmesh Chintankar

Adtran claims record for single-carrier 800G long-haul transport

New York, United States – Adtran, Inc., a provider of next-generation open and disaggregated networking solutions, announced that it has completed a field trial of 800Gbit/s single-carrier transport, achieving error-free transmission over a record distance of 2,220km in NYSERNet’s production network. The test route passed through 14 route-and-select flexgrid ROADMs comprising a total of 28 wavelength-selective switches. (more…)

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Posted by: Janmesh Chintankar

Telit Cinterion expands 5G LPWA module portfolio with new modules featuring Sony’s altair ALT1350 chipset

Telit Cinterion, a global provider of the intelligent edge, has announced new ultra-compact 5G low-power wide area (LPWA) modules for a wide variety of indoor and outdoor IoT applications that require long battery life and long service life. The modules feature the ALT1350 chipset from Sony Semiconductor Israel (Sony), a chipset that supports both unlicensed spectrum and satellite connectivity in a single chipset, enabling faster development, lower power, smaller size and new use cases. (more…)

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March 3, 2023

Posted by: Shriya Raban

Rohde & Schwarz, Broadcom extend test collaboration for latest Wi-Fi 7 access point chipsets

Rohde & Schwarz and Broadcom have validated the R&S CMP180 radio communication tester for production testing of the latest Broadcom Wi-Fi 7 access point chipsets. A Wi-Fi 7 test setup with the R&S CMP180 and a Broadcom Wi-Fi 7 device will be demonstrated at the Rohde & Schwarz booth at the Mobile World Congress 2023 in Barcelona. (more…)

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Posted by: Shriya Raban

Qualcomm selects Adobe to enhance customer relationships with real-time personalisation

Adobe has announced a collaboration with Qualcomm Incorporated to help fuel its digital strategy and that of its affiliated companies. (more…)

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March 2, 2023

Posted by: Shriya Raban

Thales partners with L&T, Qualcomm to enable 5G private networks in urban railways

L&T Technology Services Limited, a global pure-play engineering services company, has announced it has been selected by Thales to offer 5G driven next-gen connectivity solutions, which will include collaboration with Qualcomm Technologies, Inc., allowing it to provide solutions for the benefit of urban railway operators. (more…)

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Posted by: Shriya Raban