Data is created at the edge and bringing processing power close to the source generates real-time information on which informed decisions and actions can be taken at the local level. This development — edge computing — has been driven by cost and time. (more…)
March 20, 2018
Posted by: Zenobia Hegde
Microsemi Corporation, a provider of semiconductor solutions differentiated by power, security, reliability and performance, announced enhancements to its Switchtec PCIe advanced Fabric Switch (PAX), which now provides high-performance fabric connectivity and composability for multi-host graphics processing unit (GPU) (more…)
March 16, 2018
Posted by: Zenobia Hegde
Silicon Labs has introduced a new family of low-power PCI Express® (PCIe®) Gen 1/2/3/4 clock buffers that provide ultra-low jitter clock distribution in 1.5 V and 1.8 V applications. With additive jitter performance of 40 fs RMS (typical), Silicon Labs’ new Si532xx PCIe clock buffers provide more than 90% margin (more…)
Posted by: Zenobia Hegde
Farnell element14 has announced the launch of the Raspberry Pi 3 Model B+, the fastest and most powerful version yet, enhancing the already successful Raspberry Pi 3 Model B. Built on a new quad-core Broadcom BCM2837 64-bit application processor running at 1.4GHz, the Raspberry Pi 3 Model B+ is over 15% faster than the Raspberry Pi 3 (more…)
March 15, 2018
Posted by: Zenobia Hegde
Panasonic announced that Sygic has joined its Independent Software Vendor Partner Programme to offer the most advanced mobile navigation solutions with its range of Panasonic Toughbook rugged notebook, Toughpad tablets and handheld devices. (more…)
March 13, 2018
Posted by: Zenobia Hegde
Farnell element14, The Development Distributor, now stocks KC-LINK Surface Mount Capacitors from KEMET, manufacturers of advanced capacitors and components. KEMET’s KC-LINK surface mount capacitors are designed to meet the growing demand for fast switching semiconductors that operate at a higher voltage, (more…)
March 7, 2018
Posted by: Zenobia Hegde
Accedian, the global end-to-end network performance assurance experts, announced that it has partnered with Lanner Electronics Inc., to integrate its fully virtualised SkyLIGHT™ performance assurance platform into Lanner’s x86 network platform. (more…)
March 6, 2018
Posted by: Zenobia Hegde
Microsemi Corporation, a provider of semiconductor solutions differentiated by power, security, reliability and performance, announced DIGI-G5, the newest member of its award-winning DIGI franchise, enabling packet optical transport platforms to triple in capacity while slashing power consumption by 50% per port. (more…)
Posted by: Zenobia Hegde
Achronix Semiconductor Corporation, a provider in field programmable gate array (FPGA)-based hardware accelerator devices and embedded FPGA (eFPGA), announced its collaboration with AccelerComm Ltd, a semiconductor intellectual property (IP) company focusing on next-generation wireless communications acceleration. (more…)
March 1, 2018
Posted by: Zenobia Hegde
During the Mobile World Congress (MWC) in Barcelona, Telefónica and Huawei jointly demonstrated the industry’s first VR service using 5G end-to-end (E2E) network slicing technology. The demonstration offered visitors the opportunity to enjoy the ultimate immersive 5G interaction experience. (more…)
February 28, 2018
Posted by: Zenobia Hegde