Press Releases

Global 5G connections to reach 3.2bn by 2026

A new study from Juniper Research has found that the total number of 5G connections will reach 3.2 billion by 2026; rising from 310 million in 2021. To maximise the monetisation of this significant growth in connections, it predicts that operators will accelerate investment into standalone 5G networks to best position their services to manage future capacity. (more…)

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August 10, 2021

Posted by: Anasia D'mello

Revolutionising AR with Infineon’s new MEMS scanner for eyeglasses and head-up displays

What if your everyday eyeglasses became the next media for augmented reality applications? What if every car could display valuable data on the whole windshield to securely guide you through the traffic? The new MEMS* scanner solution from Infineon Technologies AG, comprising a MEMS mirror and MEMS driver, allows completely new product designs. Its miniature size and low power consumption are the basis for making augmented reality (AR) solutions more widely available for consumer applications such as wearables and for automotive head-up displays. (more…)

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August 9, 2021

Posted by: Anasia D'mello

Ivanti acquires IIoT platform to help supply chain customers further automate workflows

Ivanti Wavelink, the supply chain business unit of Ivanti, announced it has acquired an industrial internet of things (IIoT) platform owned by the WIIO Group, one of Ivanti Wavelink’s innovative technology and channel partners based in Paris, France. (more…)

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August 5, 2021

Posted by: Anasia D'mello

Highly integrated Renesas PMIC optimised for RZ/G2L and V2L MPUs delivers complete power solution to reduce design time

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, introduced the RAA215300 PMIC (Power Management IC) optimised to complement Renesas’ RZ/V2L and RZ/G2L microprocessors (MPUs) designed for AI-enabled applications. (more…)

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Posted by: Anasia D'mello

Infineon introduces USB PD 3.1 high-voltage microcontroller with higher wattage support

Infineon Technologies AG introduced the industry’s high-voltage microcontroller (MCU) with USB Power Delivery (USB PD) 3.1 support. The EZ-PD PMG1 (Power Delivery Microcontroller Gen1) is Infineon’s generation of USB PD MCUs targeting any embedded system that provides or consumes power with high-voltage up to 28 V (140 W). (more…)

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July 30, 2021

Posted by: Anasia D'mello

Renesas and Syntiant develop voice-controlled multimodal AI solution combining advanced vision and voice technologies

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, and Syntiant Corp., a deep learning chip technology company advancing low-power intelligent voice and sensor processing in edge devices, announced the joint development of a voice-controlled multimodal AI solution that enables low-power contactless operation for image processing in vision AI-based IoT and edge systems, such as self-checkout machines, security cameras, and video conference systems, and smart appliances such as robotic cleaning devices.

(more…)

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July 28, 2021

Posted by: Anasia D'mello

NETSCOUT launches smart edge monitoring solution

NETSCOUT Systems, Inc, a provider of cybersecurity, service assurance, and business analytics solutions, introduced NETSCOUT Smart Edge Monitoring to give IT teams complete visibility and insights to assure the highest-quality end-user experience in any network or application regardless of where employees perform their job. (more…)

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Posted by: Anasia D'mello

Security of HCE strengthened by Calypso transport association to support android ticketing growth

Calypso Networks Association (CNA) has announced the launch and deployment of its HCE Calypso Interoperable Application (HCIA). The solution enables transport operators and authorities to deliver Calypso ticketing using host card emulation (HCE) technology on Android devices while maintaining robust Calypso security standards. (more…)

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July 27, 2021

Posted by: Anasia D'mello

Consumers want connected packaging to help recycling, says new report

A report released by SharpEnd reveals why consumers engage with connected packaging using different technologies such as QR, NFC and AR. The report from the full-service partner to major brand owners across connected packaging and retail, unearths some surprising consumer trends and attitudes. (more…)

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Posted by: Anasia D'mello

Innodisk releases industrial-grade 112-layer 3D TLC SSDs with capacity and complete product line

Innodisk, a global provider of industrial flash and memory solutions, announces its industrial-grade 112-Layer 3D TLC SSDs along with the capacity up to 8TB. (more…)

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July 23, 2021

Posted by: Anasia D'mello