Press Releases

Emtelle launches indoor pre-connectorised fibre microduct system

Emtelle, a provider of blown fibre and ducted network solutions for the telecoms industry, launched a ground-breaking new product to meet new indoor fire regulations. Based on the QWKconnect pre-connectorised fibre microduct system, the new QWKconnect MDU is manufactured out of Low Fire Hazard (LFH) material,  (more…)

Read more

February 13, 2018

Posted by: Zenobia Hegde

ip.access updates ‘complete platform’ for small cell applications

ip.access, the independent small cell solution provider, has launched an upgrade to its S60z access point (AP) module  – bringing together GSM, 3G, FDD LTE and TDD LTE capabilities in one streamlined platform for the first time. The updated platform will allow integrators to build even more agile APs and receivers at even lower cost. (more…)

Read more

Posted by: Zenobia Hegde

Vienna to host WSA Global Congress 2018 assembling start-ups and digital entrepreneurs from over 120 countries

While Silicon Valley still dominates tech start-ups at the billion dollar end of the scale, our increasingly connected world has sprouted a number of other thriving start-up hubs. WSA’s mission is simple enough – to award and promote the most creative entrepreneurs using digital innovation for a benefit to society – and that in over 180 countries. (more…)

Read more

Posted by: Zenobia Hegde

Acuity Brands to acquire building analytics provider Lucid Design Group

Acuity Brands, Inc reported that it has acquired Lucid Design Group, Inc., an Oakland, CA-based provider of building analytics through its industry-leading BuildingOS® business intelligence platform. (more…)

Read more

Posted by: Zenobia Hegde

Transatel chooses Gemalto to enable effortless cellular connectivity for users of laptops and tablets with Windows 10

Gemalto, the provider of digital security, is supplying Transatel, a provider in global mobile & IoT connectivity, with a remote subscrip​tion management platform. It will enable users of Windows 10 eSIM-equipped PCs to get online swiftly and seamlessly, from the moment they first power up their device. (more…)

Read more

February 12, 2018

Posted by: Zenobia Hegde

Farnell element14 launches GraspIO Cloudio, a Raspberry Pi add-on board with Drag and Drop programming interface

Farnell element14, the Development Distributor, announces the launch of GraspIO Cloudio – a Raspberry Pi add-on board with Drag and Drop programming interface on iPhone, iPad, Android. Among other features, it incorporates Voice Assistant Capabilities, IFTTT (“If This Then That”) Integration, (more…)

Read more

Posted by: Zenobia Hegde

Wirecard selects Astute Solutions for conversational service chatbot technology

Astute Solutions announced their selection by Wirecard, a global provider in digital financial technology, to implement Astute’s chatbot software into the boon app – Europe’s fastest-growing mobile payment solution. (more…)

Read more

Posted by: Zenobia Hegde

nCube modular smart home hub platform to be available in the market soon

From heating to lighting, music to sensors, nCube gives complete control over the right ambience, security, energy and safety in the home through the modular hub and app. The 4 layers of stylish blue boxes will make any home smarter than ever before by bringing home automation to everyone’s fingertips.

(more…)

Read more

February 9, 2018

Posted by: Zenobia Hegde

D-Link launches 180° outdoor camera for secure and remote home monitoring

D-Link, a global provider of Wi-Fi connectivity and video surveillance technology, has announced its latest addition to its growing range of mydlink cameras – the Full HD 180° Outdoor Wi-Fi Camera (DCS-2670L). (more…)

Read more

Posted by: Zenobia Hegde

World’s smallest Sigfox SiP integrates IoT connectivity on a single ultra-low power IC

Alpha Micro is pleased to announce availability of the ON Semiconductor AX-SIP-SFEU, a Sigfox-certified programmable RF transceiver System-in-Package (SiP) that integrates critical IoT connectivity functions into a single, tiny, ultra-low-power IC package. (more…)

Read more

Posted by: Zenobia Hegde