Devices and Modules - Page 103 of 342 - IoT global network

Press Releases

ETSI and MIPI Alliance announce incorporation of MIPI I3C Basic into ETSI smart secure platform

Piscataway, United States and Sophia Antipolis, France. 30 June, 2022 – The MIPI Alliance, an international organisation that develops interface specifications for mobile and mobile influenced industries, and ETSI technical committee secure element technologies (TC SET) announced the adoption of the I3C Interface for SSP (ETSI TS 103 818) specification, allowing the MIPI I3C Basic specification to serve as a physical and logical link layer for the ETSI smart secure platform (SSP). (more…)

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June 30, 2022

Posted by: Janmesh Chintankar

The power of audio meets the power of virtual desktops: EPOS & 10ZiG announce new partnership

Leicester, United Kingdom – EPOS, a global brand designing high end audio solutions for better communication and collaboration, and 10ZiG, a provider of virtual desktop endpoint hardware and software, have partnered to deliver EPOS audio devices and management software optimised for 10ZiG Windows 10 IoT Thin Client endpoint devices. (more…)

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Posted by: Janmesh Chintankar

Siemens launches building X, an open AI-enabled suite for net zero buildings

30 June 2022 – Siemens Smart Infrastructure has launched Building X, a new smart building suite that is open, interoperable and fully cloud-based. The suite is the first next generation offering built on the design principles of Siemens Xcelerator, an open digital business platform launched today to accelerate digital transformation and value creation across industry, transportation, grids and buildings. (more…)

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Posted by: Shriya Raban

Advantech introduces COM-HPC module with ultra-powerful AMD EPYCTM Embedded 7003 server processors

Taipei, Taiwan and Munchen, Germany, 30 June 2022 – Advantech, a provider of embedded computing solutions introduced the COM-HPC Server-on-Module with AMD EPYC 7003 Embedded processors at embedded world 2022. With 64 cores, the new COM-HPC Size E Server-on-Modules (200 x 160 mm) provide more than triple the number of available edge server cores compared to any other COM-HPC server module on the market offering edge server engineers an immense performance leap. (more…)

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Posted by: Shriya Raban

Increasing demand for human-drone collaboration and the maturity of 5G to spur growth in the drone market

The market of small unmanned aerial systems (sUAS), commonly known as drones, continues to grow, and global technology intelligence firm ABI Research predicts total worldwide shipments of sUAS ecosystems to reach 3 million by 2025, increasing at a 25% compound annual growth rate (CAGR). COVID-19 has driven the need for more human-drone collaboration. (more…)

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Posted by: Shriya Raban

Accenture announces Intent to acquire XtremeEDA to expand silicon design capabilities in Canada and US

Toronto and Austin. 27 June 2022 – Accenture has entered into an agreement to acquire XtremeEDA, an Ottawa-based silicon design services provider. The company provides semiconductor engineering services for clients seeking custom silicon solutions used in consumer devices, cloud data centres, machine learning and artificial intelligence (AI) computational platforms to enable edge AI deployment. The terms of the acquisition were not disclosed. (more…)

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Posted by: Shriya Raban

Teledyne FLIR introduces FlexView lens to provide thermographers with two lenses in one

Teledyne FLIR, part of Teledyne Technologies Incorporated, introduced the FlexView dual field of view (DFOV) lens attachment for FLIR Axxx and Txxx series thermography cameras designed to improve operational efficiency, safety, and accuracy from switchyards to the plant floor. (more…)

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June 28, 2022

Posted by: Janmesh Chintankar

Infineon launches battery-powered AI/ML-based acoustic event detection and sensor fusion alarm system

Munich, Germany. 28 June 2022 – Infineon Technologies AG is introducing its battery-powered Smart Alarm System (SAS). The technology platform achieves high accuracy and very low-power operation using sensor fusion based on artificial intelligence/machine learning (AI/ML).

(more…)

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Posted by: Shriya Raban

uEye XC closes the market gap between industrial camera and webcam

Unlike webcams from the consumer sector, uEye XC is specially designed for industrial requirements. Its components score with long availability a must for industrial applications. It is used, for example, in kiosk systems, logistics, in the medical sector and in robotics applications. (more…)

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Posted by: Janmesh Chintankar

Siemens acquires Brightly Software to accelerate growth in digital building operations

Siemens Smart Infrastructure (SI), the frontrunner in digital buildings, has signed an agreement to acquire Brightly Software, the U.S.-based software-as-a-service (SaaS) provider of asset and maintenance management solutions. (more…)

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Posted by: Shriya Raban