Press Releases

Senet, ST Microelectronics and Tago partner to create value from connected products and user interactions

Senet, a provider of cloud-based software, global connectivity service platforms and network buildout for the Internet of Things (IoT), is partnering with ST Microelectronics, a global semiconductor provider serving customers across the spectrum of electronics applications and Tago, (more…)

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March 23, 2018

Posted by: Zenobia Hegde

GlobalPlatform and IoT Connectivity Alliance sign MoU to develop and support industry-wide standards for IoT security

A Memorandum of Understanding (MoU) has been agreed between industry associations GlobalPlatform and the IoT Connectivity Alliance (ICA). The two technical bodies will work to develop and promote a standardised approach to internet of things (IoT) security based on secure component technology. This will reduce the cost and streamline the development of large-scale consumer and industrial IoT deployments. (more…)

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March 21, 2018

Posted by: Zenobia Hegde

New Arrow ARIS-EDGE-S3 kit simplifies development of battery-powered applications with compact TFT display

Arrow Electronics has extended its convenient and flexible ARIS (Arrow Renesas IoT Synergy) platform for developing Internet of Things (IoT) devices by introducing the ARIS-EDGE-S3, which packs extra compute performance and the opportunity to add a compact user interface for richer interactions. (more…)

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Posted by: Zenobia Hegde

Microsemi expands market opportunities for cloud data centres with announcement of Adaptec Smart Storage compatibility with AMD EPYC processor

Microsemi Corporation, a provider of semiconductor solutions differentiated by power, security, reliability and performance, announced interoperability between its 12 gigabits per second (Gbps) SAS/SATA host bus adapters (HBAs) and redundant array of independent disk (RAID) adapters, including the Microsemi Adaptec HBA 1100, (more…)

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Posted by: Zenobia Hegde

Barcelona lights up with next gen Wi-Fi (Passpoint™)

The Wireless Broadband Alliance (WBA), together with The GSMA, Fira Barcelona and the city of Barcelona launched a successful next generation Wi-Fi (Passpoint™) deployment at Mobile World Congress 2018, demonstrating how advanced wireless hotspots can fuel connectivity for smart cities. (more…)

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March 19, 2018

Posted by: Zenobia Hegde

Microsemi enhances Switchtec PCIe switch for fabric connectivity and composability of multi-host GPU and NVMe SSD systems

Microsemi Corporation, a provider of semiconductor solutions differentiated by power, security, reliability and performance, announced enhancements to its Switchtec PCIe advanced Fabric Switch (PAX), which now provides high-performance fabric connectivity and composability for multi-host graphics processing unit (GPU) (more…)

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March 16, 2018

Posted by: Zenobia Hegde

Wireless Logic Group acquires Mdex AG, expects 2018/’19 group revenue contribution of €8m

Wireless Logic, Europe’s IoT connectivity platform provider announced the acquisition of Mdex AGthe leading German M2M and IoT service and solution provider for encrypted data communications via mobile networks, DSL and satellite. (more…)

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Posted by: Zenobia Hegde

QualiTest releases advanced IoT testing solution

QualiTest Group, the pure play QA and independent software testing company, announced the launch of a comprehensive testing solution dedicated to IoT. The offering was developed over the course of testing thousands of IoT projects involving both hardware and software, and across diverse software ecosystems. (more…)

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Posted by: Zenobia Hegde

Upgraded Raspberry Pi has a more powerful CPU, offers faster Ethernet and dual-band wireless networking

Farnell element14 has announced the launch of the Raspberry Pi 3 Model B+, the fastest and most powerful version yet, enhancing the already successful Raspberry Pi 3 Model B. Built on a new quad-core Broadcom BCM2837 64-bit application processor running at 1.4GHz, the Raspberry Pi 3 Model B+ is over 15% faster than the Raspberry Pi 3 (more…)

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March 15, 2018

Posted by: Zenobia Hegde

Renesas Synergy™ strengthens chip-to-cloud IoT connectivity with new Enterprise Cloud Toolbox

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced the new Renesas Synergy™ Enterprise Cloud Toolbox v1.1 — a software Application Project that together with the Synergy AE-CLOUD1 kit provides a reference design and starting point for users to connect in 10 minutes or less to enterprise clouds such as Microsoft Azure™, Amazon Web Services, and Google Cloud Platform. (more…)

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March 13, 2018

Posted by: Zenobia Hegde