Press Releases

Laird Connectivity unveils Tungsten700 SMARC system-on-module with Wi-Fi 6, Bluetooth 5.3

July 21, 2023

Posted by: Janmesh Chintankar

Richard Lu of MediaTek

Laird Connectivity, a global provider in wireless technology and system-on-modules (SOMs), announced the Tungsten700 SOM in a smart mobility architecture (SMARC) form factor, developed in partnership with MediaTek. The Tungsten700 SMARC is powered by the MediaTek Genio 700 processor and Laird Connectivity’s upcoming Sona MT320 Wi-Fi 6/Bluetooth 5.3 module, based on the MediaTek Filogic 320 Wi-Fi/Bluetooth combo radio.

Together these solutions provide a compute and connectivity platform. This high-performance SOM, when used with the new SMARC carrier, also serves as a single board computer (SBC) that can speed customer products to market.

“The Tungsten700 heralds the start of our collaboration with MediaTek to bring smartphone comparable processing and features to the embedded IoT space, leveraging MediaTek’s decades of experience in next-generation connectivity and computing to create a smart, efficient, high-end connected system,” says Dan Kephart, senior product manager, Laird Connectivity. “Available in the SMARC 2.1.1 form factor, this robust product provides a high performance and power efficient IoT solution that easily scales with customer’s applications.”

This product is a solution for demanding use cases, utilising Arm DynamIQ multiprocessing which combines the performance of a dual-core 2.2 GHz Arm Cortex-A78 and power-optimised hexa-core Arm Cortex-A55 operating at 2.0 GHz. This octa-core architecture allows for balancing power efficiency with the availability of peak computing performance.

Customers can also leverage hardware acceleration AI (artificial intelligence), delivering up to 4 TOPS/Watt, an Arm Mali-G57 GPU (graphics processing unit), hardware accelerated 4K video codecs, an audio DSP (digital signal processors), and advanced 32MP video HDR ISP. Multiple display, network, data, audio, and camera interfaces are also available.

“Laird Connectivity and Boundary Devices are trusted leaders in the SOM and wireless module space, making them a fantastic partner for MediaTek,” says Richard Lu, vice president of IoT business at MediaTek. “By utilising the MediaTek Genio 700 combined with the MediaTek Filogic 320, we can effectively address the many diverse IoT applications and market segments, enabling a wide variety of benefits for our customers.”

The Tungsten700 conforms to the SMARC 2.1.1 standard form factor (82mm x 50mm), with a SMARC edge connector, on board ethernet PHYs (physical layer), and a USB (universal serial bus) hub controller. The SMARC standard offers a future upgrade route to the new processor, memory, and wireless SOM configurations and simplifies designing for multiple performance options.

The Tungsten700 SMARC is suitable for a broad range of applications, including industrial vision systems, smart signage and retail POS (point of sale), industrial tablets and handhelds, industrial IoT gateways, autonomous and automated robots and vehicles, and more. It supports a variety of operating systems including Yocto Linux, Android, and Ubuntu. Boundary Devices products are designed to meet the needs of the industrial and medical markets, which typically require a 10+ year product lifecycle.

For more information about the Tungsten700 SMARC, visit Laird Connectivity.

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