Press Releases

Chinese packaging company Baoshen buys PragmatIC’s flexible integrated circuits

June 21, 2019

Posted by: Anasia D'mello

Scott White of PragmatIC

PragmatIC, a provider of ultra-low-cost flexible electronics, reports that BSN, part of the Baoshen Group, has placed an order for its recently released ConnectIC products. PragmatIC offers flexible integrated circuits to add intelligence to mass-market consumer goods and packaging.

Founded in 1988, Baoshen Group is one of China’s packaging material suppliers for footwear, apparel, bags, furniture, cosmetics and accessories. They have an annual capacity of 7 billion print items and 1 billion RFID labels. BSN’s new Eprint line of RFID products are focused on anti-counterfeit solutions for fast-moving consumer goods (FMCG), online sales and pharmaceutical drugs, as well as consumer engagement and experience.

“We are delighted to build a relationship with Baoshen Group”, says Scott White, CEO of PragmatIC. “This new order for our novel ConnectICs re-enforces the attractiveness of our solutions to global companies who are enabling brands to protect their marque and connect with their customers.”

Philip Calderbank

ConnectICs are targeted at market segments such as food and beverage, personal and home care, pharmaceutical and healthcare. With their thin and flexible form factor, they are suitable for plastic or paper inlays which will be imperceptible when added to labels or packaging. With integrated energy harvesting and designed for use with single layer antennas, ConnectICs are designed to minimise total system cost.

“We see rapidly growing demand in Asian markets for solutions to protect brands and consumers from counterfeit products both in store and online”, adds Philip Calderbank, RFID consultant at BSN. “PragmatIC’s ultra-low-cost technology will enable us to roll out solutions to a much wider range of market segments than possible with conventional electronics.”

PragmatIC is continuing to expand production in the UK through 2019 to meet demand for its products and is working with partners to ensure that ConnectICs can be easily deployed in high-volume applications.

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