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alpitronic selects Infineon’s EasyPACK CoolSiC modules and EiceDRIVER X3 drivers

Munich, Germany. 16 December, 2021 – Following the successful launch of the HYC150 and HYC300 of their hypercharger product line, alpitronic recently introduced the state-of-the-art and 50 kW DC electric vehicle charger HYC50. It is the first wall-mounted DC charger in this power range featuring two charging ports that allow fast charging of one vehicle at 50 kW or of two vehicles simultaneously at 25 kW each. (more…)

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December 16, 2021

Posted by: Anasia D'mello

Renesas launches automotive actuator and sensor control MCUs for evolving edge applications

Dusseldorf, 16 December 2021 ―Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced two new microcontrollers (MCUs) designed for automotive actuator and sensor control applications supporting edge evolution in next-generation electronic and electrical (E/E) architecture. (more…)

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Posted by: Anasia D'mello

Oceanscan navigates ransomware event with iland secure DRaaS

London. 9 Dec 2021 – iland, a VMware-based provider for application hosting, data protection and disaster recovery services delivered on the iland Secure Cloud Platform,  announced that Oceanscan is using iland Secure DRaaS to keep its business up and running in the wake of a recent ransomware attack. (more…)

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December 15, 2021

Posted by: Anasia D'mello

Nozomi Networks and BT team to deliver advanced OT and IoT cybersecurity to enterprises worldwide

London. 14 December 2021 — Nozomi Networks Inc.the specialist in OT and IoT security, and BT, a provider of global communications and security services, announced they have partnered to broaden BT’s portfolio of security solutions available for industrial and critical infrastructure organisations around the world. A member of Nozomi Networks’ MSSP Elite Partner Program, BT will work with and resell Nozomi Networks solutions as part of its Operational Technology Threat Management portfolio. (more…)

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Posted by: Anasia D'mello

Infineon expands wireless portfolio to support matter with multiprotocol solutions

Munich, Germany. 14 December 2021 – Infineon Technologies AG announced the launch of the new AIROC Bluetooth LE and 802.15.4 family to help companies quickly bring low-power, high-performing Matter products to market. Infineon’s AIROC CYW30739 Bluetooth LE & 802.15.4 system on chip (SoC) is a reliable, secure and scalable solution to connect low-power devices in the smart home.

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December 14, 2021

Posted by: Anasia D'mello

Renesas develops write technologies for embedded STT-MRAM

Dusseldorf, December 14, 2021 ― Renesas Electronics Corporationa supplier of advanced semiconductor solutions, announced the development of two technologies that reduce the energy and voltage application time for the write operation of spin-transfer torque magnetic random-access memory (STT-MRAM, hereinafter MRAM).

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Posted by: Anasia D'mello

Samotics completes Series A funding round to lead fight against industrial energy waste

Leiden, Netherlands, 13 December 2021 — Samotics, a provider of real-time actionable insights to eliminate industrial energy waste and unplanned downtime, has completed a €14.5 million Series A funding round. The round was led by 83North, a global venture capital firm with a proven track record in building category providers across multiple domains including Internet of Things (IoT) and Artificial Intelligence (AI) technologies. (more…)

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December 13, 2021

Posted by: Anasia D'mello

Quectel and Point One Navigation bring precise location to robotics and agriculture markets

San Francisco, USA. – Quectel Wireless Solutions, a global supplier of IoT modules and antennas, and Point One Navigation, a provider of precision location technology, have announced the LG69T-AM. This is the latest addition to the LG69T GNSS Module Series. (more…)

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Posted by: Anasia D'mello

4 challenges in IoT hardware designing

IoT development is complex and bound to uncertain challenges throughout the development lifecycle. Further breaking down the development into different components, issues in hardware design are the most critical because they can’t be rolled back. (more…)

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Posted by: Yash Mehta

Qualcomm Technologies and Opel bring cutting-edge in-cabin experiences in new opel astra

London, UK. 9th December 2021 – Qualcomm Technologies, Inc. and Opel Automobile GmbH announced that the upcoming Opel Astra, Opel’s latest addition to its compact class of electrified vehicles will utilise next-generation Snapdragon Automotive Cockpit Platforms. (more…)

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December 10, 2021

Posted by: Anasia D'mello