Digi International has announced the nomination of two new members to its board of directors: Valerie Heusinkveld and Allison West Hughes. In addition, Sally Smith, a Digi director since 2018, has announced her intention to retire from the board at the conclusion of the company’s annual meeting to be held on February 3, 2025. The election of Ms. Heusinkveld and Ms. Hughes will be voted on by the company’s stockholders at that same annual meeting. (more…)
December 17, 2024
Posted by: Magda Dabrowska
Blynk, a low-code IoT SaaS platform, has partnered with Iridium Communications Inc., a provider of global voice and data satellite communications, in support of the new Iridium Certus 9704 Development Kit, an end-to-end product evaluation tool for the Iridium Certus 9704 module. This partnership allows engineering teams to jumpstart their projects with Iridium’s new hardware using Blynk’s IoT platform, creating an ideal environment for discovering and developing new Iridium satellite-based solutions. (more…)
December 13, 2024
Posted by: Anna Ribeiro
DSR Corporation (DSR) has announced that its cross-platform Zigbee stack, ZBOSS, now supports Synaptics’ Veros Seamless Intelligent Connectivity portfolio, and that Synaptics has joined the ZBOSS Open Initiative (ZOI). ZOI, founded by DSR, fosters collaboration among companies to advance Zigbee PRO software for improved IoT interoperability and streamlined development. Synaptics’ participation enhances the initiative, bringing its expertise in wireless connectivity and commitment to delivering cutting-edge Zigbee solutions. This partnership strengthens ZOI’s mission to drive innovation across IoT sectors like smart homes, energy and industrial applications, with ZBOSS empowering developers to create advanced, universally compatible Zigbee-enabled devices.
December 9, 2024
Posted by: Magda Dabrowska
u-blox has announced a new series of professional grade, multiprotocol modules designed to help companies across a broad spectrum of IoT market segments bring new wireless products to market faster. The ‘NORA-B2’ series of modules are built on Nordic’s next generation nRF54L15 SoC, and provide a cost-effective entry point for wireless connectivity for IoT applications. (more…)
November 29, 2024
Posted by: Magda Dabrowska
SIMPPLE has announced that its Singapore subsidiary had signed a partnership agreement with Bangkok-based RAAS PAL to distribute Internet of Things (IoT) sensors, robotics and the flagship SIMPPLE Software platform across Thailand. (more…)
November 28, 2024
Posted by: Magda Dabrowska
SECO and Raspberry Pi have announce a commercial agreement aimed at expanding their business opportunities through collaboration on hardware and software development. This partnership combines SECO’s expertise in IoT technologies with Raspberry Pi’s versatile computing solutions, allowing both companies to address the growing demands of industrial applications through innovative, customized products. (more…)
November 18, 2024
Posted by: Magda Dabrowska
In a move set to accelerate IoT adoption across various industries, LORIOT and MOKO SMART have announced their new partnership to deliver integrated, end-to-end LoRaWAN solutions tailored to the evolving needs of global enterprises. This collaboration comes at a critical time, as the global IoT market in manufacturing alone is projected to skyrocket from USD 27.8 billion in 2018 to USD 452.27 billion by 2032, driven by an annual growth rate of 22.1%. (more…)
November 15, 2024
Posted by: Magda Dabrowska
Ezurio (formerly Laird Connectivity), has released a family of Bluetooth LE modules based on Nordic Semiconductor’s new next generation of low power wireless SoC, the nRF54L15. The modules enable wireless product designers to bring new products to market faster, while delivering the highest level of performance, security and efficiency with ultra-low power consumption. The modules are predominantly designed for industrial, medical and commercial applications.
The ‘BL54L15 Series’ utilises the QFN48 package of Nordic’s nRF54L15 SoC. It features 31 GPIOs and comprises two module variants, that have either an integrated PCB trace antenna or a MHF4 connector on board. Both modules come in a 14 by 10 mm form factor.
The ‘BL54L15µ Series’ utilises the WSCLP package of the nRF54L15 SoC. It features 32 GPIOs and comprises two module variants that have either an integrated chip antenna or a trace pad for external antenna support. The modules come in a highly compact 6.3 by 7.9 mm form factor.
Each series of modules is optimised for high-performance applications, ensuring secure, robust and efficient wireless communication with support for the latest Bluetooth standards and secure programming options.
“The Bl54L15 and BL54L15µ module variants bring out the full capability of the market-leading, underlying Nordic silicon for the end customer to utilize in a fully pre-certified solution,” said Jonathan Kaye, the VP of product management and marketing at Ezurio. “The plethora of protocols and application support in a single hardware/software solution enables us to support the widest possible set of use cases and customer requirements for short range wireless connectivity.”
Posted by: Magda Dabrowska
InnoPhase IoT and TDK InvenSense have announced an end-to-end sensor-to-cloud platform that combines the Talaria TWO (T2) Wi-Fi SoC and TDK InvenSense’s ICU-30201 ultra-long-range ultrasonic time-of-flight range sensor. The integration provides direct connectivity to the cloud without needing external MCUs, lowers power consumption and total cost of ownership, and dramatically increases battery life. The solution targets applications such as smart locks, video cameras, access control systems and others for Smart Homes, Building Automation and Industrial IoT. (more…)
November 13, 2024
Posted by: Magda Dabrowska
HTEC has announced the acquisition of eesy-innovation, embedded hardware and software engineering company based in Munich, Germany, and Granada, Spain. This acquisition is part of HTEC’s overall strategy to further enhance its capabilities in embedded and IoT technologies and AI solutions, creating additional value for clients and providing growth opportunities for the talent of both companies. At the same time, this acquisition further strengthens HTEC’s footprint in the EU, and especially DACH region. (more…)
November 8, 2024
Posted by: Magda Dabrowska