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SealSQ's VaultIC 408

SEALSQ’s VaultIC 408 Meets FIPS 140-3 Requirements, Advancing NIST Certification and Strengthening Leadership in Secure IoT and Smart Grid Solutions

SEALSQ Corp, a company that focuses on developing and selling Semiconductors, PKI and Post-Quantum technology hardware and software products, has announced a development in the field of network security. As per the UL Labs report, VaultIC 408 meets FIPS 140-3 requirements, advances NIST certification and strengthens SEALSQ’s leadership in secure Internet of Things (IoT) and smart grid solutions.

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May 6, 2025

Posted by: Marion Webber

Industrial IoT with relating icons floating around

New Northern.tech report reveals critical gaps in IoT device lifecycle management

Northern.tech, a contributor in device lifecycle management, has released its inaugural State of Industrial IoT Device Lifecycle Management report. Based on insights from over 500 embedded professionals across industries, the report uncovers how OEMs are navigating the shift to a software-centric economy — and the operational, cultural and compliance challenges that come with it.

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May 5, 2025

Posted by: Marion Webber

LoRa Alliance brings LoRaWAN to IoT Solutions World Congress

The LoRa Alliance, the global association of companies backing the open LoRaWAN standard for the internet of things (IoT) low-power wide-area networks (LPWANs), has announced that it will bring together its extensive LoRaWAN ecosystem as part of IoT Solutions World Congress (IOTSWC), taking place May 13–15, 2025, at Barcelona’s Gran Via Venue. Under the banner “Building Massive IoT with LoRaWAN,” the organisation will feature a day-long program dedicated to LoRaWAN on May 14. Beyond the stage talks, members will share insights about their success stories as part of several show floor talks, including those from 19 LoRa Alliance member companies who will demonstrate LoRaWAN in Action! in Hall 8 Stand D9.

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May 2, 2025

Posted by: Marion Webber

A phone with SIM cards

Giesecke+Devrient becomes first company to achieve GSMA eSIM compliance and certification for IoT eUICC product

In January, the GSMA, the global organisation unifying the mobile ecosystem, introduced a new industry-wide technical specification called SGP.32 v1.2, together with test, compliance and security specifications to ensure eSIM Internet of Things (IoT) technologies, used within IoT products, are secure and interoperable when interacting with communications networks and service platforms around the world. The GSMA has now included certification of this specification as part of its GSMA eUICC Security Assurance scheme and eSIM Compliance program, ensuring eSIM IoT products comply with stringent security and interoperability requirements, alongside already established consumer and machine-to-machine eSIM product certification. (more…)

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April 30, 2025

Posted by: Marion Webber

Faraday adds QuickLogic eFPGA to FlashKit‑22RRAM SoC for IoT Edge

QuickLogic Corporation, a developer of embedded FPGA (eFPGA) Hard IP and user tools, ruggedised FPGAs, and endpoint artificial intelligence (AI)/machine learning (ML) solutions, has announced that its eFPGA IP is now integrated into Faraday Technology Corporation‘s cutting-edge FlashKit-22RRAM SoC Development Platform. The collaboration gives designers flexibility and adaptability to address a broad range of Internet of Things (IoT) applications.

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April 28, 2025

Posted by: Marion Webber

Identiv partners with Tag-N-Trac to market IoT solutions for cold chain tracking and compliance

Identiv, Inc., a global contributor in RFID- and BLE-enabled Internet of Things (IoT) solutions, has announced a business development and marketing partnership with Tag-N-Trac, a full stack IoT platform provider for real-time supply chain visibility and traceability. This new partnership will initially focus on developing and commercialising specialised IoT solutions for cold chain tracking within the pharmaceutical industry supply chain.

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April 25, 2025

Posted by: Marion Webber

Nordic Semiconductor’s nRF9151 cellular IoT module enhances IIJ SoftSIM capabilities in Japan

Nordic Semiconductor’s nRF9151 low power module for advanced cellular Internet of Things (IoT) applications now includes SoftSIM support for Japan’s only SoftSIM provider, Internet Initiative Japan Inc. (IIJ). By using a SoftSIM instead of a traditional SIM, product developers can reduce SIM and Bill of Materials (BoM) costs, simplify design and lower power consumption for cellular IoT end products based on Nordic’s nRF9151 module. SoftSIM is ideal for space-constrained cellular IoT devices with low power consumption requirements, such as wearables and smart sensors.

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April 21, 2025

Posted by: Marion Webber

A water tap that is open

Norway’s Horten Municipality employs Nordic Semiconductor-powered cellular IoT monitoring solution to address drinking water waste from pipe leaks

Horten Municipality in southern Norway, and local smart condition monitoring solution provider, 7Sense, have collaborated on a cellular Internet of Things (IoT)-based project designed to detect leaks in drinking water networks in the region. The solution is powered by Nordic Semiconductor’s nRF9160 low power module with integrated LTE-M/NB-IoT modem and GNSS, and the project is supported by the Norwegian Institute of Public Health.

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April 10, 2025

Posted by: Marion Webber

An airplane posing with boxes on a blue background

SkyCell and ACL Airshop partner to bring IoT-powered visibility and control to ULD management

In today’s fast-paced air cargo environment, keeping track of every unit load device (ULD) is critical for smooth operations. Every day, airlines contend with the challenge of displaced ULDs—industry estimates suggest that about 5% of ULDs are misplaced at any given time. It’s clear that the industry is in need of proven digitalisation solutions.

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April 7, 2025

Posted by: Marion Webber

Trusted Connectivity Alliance updates eSIM specification to enhance secure remote SIM provisioning for 5G and constrained IoT devices

Trusted Connectivity Alliance (TCA) has released Version 3.4 of its eUICC Profile Package: Interoperable Format Technical Specification (Interoperable Profile Package Specification). The latest version includes updates to support full alignment with 3GPP Release 18 to enable advanced 5G functionality and secure authentication in 5G network slicing, as well as enabling the remote management of eSIM profiles on low-power and network-constrained devices. Additional updates and clarifications to promote security and interoperability have also been made.

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April 3, 2025

Posted by: Marion Webber