The OPC Foundation has announced a new joint working group effort with the LoRa Alliance to develop a mapping from LoRaWAN to OPC UA, bringing together two highly complementary technologies that play important roles in the future of industrial and IoT connectivity. This collaboration aims to define how data and information models originating from LoRaWAN-based devices and systems can be represented in OPC UA, enabling improved interoperability between low-power wide-area network (LPWAN) deployments and industrial automation, enterprise and cloud-based systems.
April 23, 2026
Posted by: Marion Webber
Event date: May 13-15, 2026
Kuala Lumpur, Malaysia
April 22, 2026
Posted by: Marion Webber
Identiv, a global contributor in RFID- and BLE-enabled Internet of Things (IoT) solutions, has announced the expansion of its ID-Safe product family, a portfolio of advanced HF and NFC tags designed to support product authentication, tamper detection and secure traceability across pharmaceutical, healthcare, retail, food and beverage, electronics and smart packaging applications.
April 21, 2026
Posted by: Marion Webber
NextPlat, a global consumer products and services company providing healthcare and technology solutions through e-commerce and retail channels worldwide, has announced that its Global Telesat Communications Ltd (GTC) subsidiary continues to see strong demand for satellite-enabled Internet of Things (IoT) hardware from providers including Globalstar and Iridium, receiving new orders valued at approximately $400,000 in support of an existing military end-user in Eastern Europe and a new customer in Asia.
April 16, 2026
Posted by: Marion Webber
Bosch and Qualcomm Technologies has announced that they are expanding their partnership, which has focused on vehicle computers for cockpit solutions, to also include ADAS solutions. Together, Bosch and Qualcomm Technologies are helping address one of the industry’s most pressing needs – scaling intelligent vehicle technology to meet growing consumer demand for vehicles that are automated, connected and highly personalised. The companies also highlighted a significant step in their longstanding collaboration: Bosch has developed and delivered more than 10 million vehicle computers based on Qualcomm Technologies’ Snapdragon Cockpit Platforms for the global automotive market.
April 14, 2026
Posted by: Marion Webber
As IoT connectivity is growing rapidly worldwide, the LoRa Alliance is seizing the opportunity for LoRaWAN technology to become a globally ubiquitous, plug-and-play IoT connectivity method embedded into everyday objects and capable of delivering increasing value to users.
April 9, 2026
Posted by: Marion Webber
The UK’s path to net‑zero road transport is entering a decisive phase. On one side, the government is holding firmly to its Zero Emission Vehicle (ZEV) Mandate, positioning the UK as a frontrunner in decarbonising mobility. On the other, the automotive industry is warning that the pace and rigidity of current policy risk outstripping economic reality, technology readiness and consumer demand.
April 7, 2026
Posted by: Marion Webber
ETSI Software Development Group OpenCAPIF (SDG OCF) has announced Release 4.0.0. With 3GPP Release 19 alignment and improved architecture, this release includes upgrades to boost security and flexibility all around. OCF Release 4 introduces the first phase of Visibility Control, a gamechanger for API access management, alongside a fully revamped certificate architecture and smoother deployments.
Posted by: Marion Webber
High tech wireless product developer, Shenzhen Holyiot Technology, has announced a Bluetooth LE-powered ‘e-ink’ smart badge, designed for a wide range of access control and identity verification use cases. The ‘Inkcard-A1’ smart badge employs Nordic Semiconductor’s nRF54L15 SoC that doubles the processing power and triples the processing efficiency of the previous generation of SoCs. This enables the smart badge to perform a wide range of time critical tasks in offices or workplaces.
April 2, 2026
Posted by: Marion Webber
Tencent Cloud, the cloud business of global technology company Tencent, has announced its partnership with ComfyUI, one of the world’s most popular free, open–source, node–based visual AI platform for generative content creation. Through this collaboration, ComfyUI integrates Tencent HY 3D Global as its native Partner Nodes, enabling millions of creators worldwide to incorporate advanced 3D generation workflows into their pipelines.
March 31, 2026
Posted by: Marion Webber