Press Releases

IoT Global Awards 2026 shortlist banner, showing a lion’s face in black and white with the words IoT Global Awards 2026 and Shortlist

IoT Global Awards reveals its 2026 shortlist

IoT Global Awards has revealed its 2026 shortlist, recognising companies, products, services and leaders whose work is advancing connected technology around the world. (more…)

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September 16, 2026

Posted by: Marion Webber

Close-up of SIM cards and eSIM chip components on a flat surface, representing eUICC hardware used in SGP.32 IoT eSIM provisioning

COMPRION works with STMicroelectronics to provide reference environment for SGP.32 IPAd testing

COMPRION and STMicroelectronics have jointly validated an end-to-end test environment for IoT Profile Assistant (IPAd) implementations under the GSMA SGP.32 specification.

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September 15, 2026

Posted by: Marion Webber

IoT Global Awards banner

Two days left: The 2026 IoT Global Awards programme closes for entries this Friday

The IoT Global Awards will stop accepting entries for this year’s programme, at 17:00 CET on Friday 11th September.

Entries are to be submitted via the official IoT Global Awards site and the shortlist of entries will be announced on Wednesday 16th September. The winners will be announced on Wednesday 7th October.

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September 8, 2026

Posted by: Marion Webber

The Product Certification Program for Zigbee sub-GHz (Suzi)

Suzi Product Certification is now open

The next phase of Zigbee innovation is here, and it’s built for scale, reach and reliability.

Following the introduction of Zigbee 4.0 and Suzi, the Connectivity Standards Alliance’s new sub-GHz connectivity solution, we are excited to announce the opening of the Product Certification Program for Zigbee sub-GHz (Suzi).

This marks a significant step forward in enabling the industry to bring standardized long-range, low-power, and interoperable IoT products to market, backed by the trusted Zigbee ecosystem.

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September 3, 2026

Posted by: Marion Webber

The nRF93M1 smart modem

Nordic Semiconductor takes the nRF93M1 smart modem global

Nordic Semiconductor, a global contributor in low-power wireless connectivity solutions, has announced that its multi-regional nRF93M1-LABA smart modem module, introduced at Mobile World Congress in March 2026, has reached general availability with Global Certification Forum (GCF) compliance, alongside the start of sampling for the nRF93M1-LACA, a pin-, and software-compatible global-band variant. Together, they give developers a faster path to deploying Cat 1 bis connected devices across global markets without redesigning their hardware for each region.

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August 25, 2026

Posted by: Marion Webber

Arqia, a Wireless Logic company, acquire Algar Telecom’s IoT business

Wireless Logic has announced the signing of an agreement to acquire Algar Telecom’s IoT connectivity business, part of Algar Group’s IT and telecommunications company, which will become part of Arqia upon completion.

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August 13, 2026

Posted by: Marion Webber

New LoRa Alliance standards Make LoRaWAN deployments faster, simpler and more scalable

The LoRa Alliance, the open, non-profit organisation defining, evolving and promoting the LoRaWAN standard, has took a significant step in achieving effortless, low-touch deployment at scale with new specifications that enable automated device set-up and a new technical document that extends LoRaWAN’s connectivity reach.

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August 6, 2026

Posted by: Marion Webber

A Wi-Fi chip

Quectel’s FGH200M Wi-Fi HaLow module now FCC/IC/CE/RCM certified for mass production

Morse Micro, one of the world’s Wi-Fi HaLow silicon provider, has announced that Quectel’s FGH200M module has passed FCC/IC/CE/RCM certification. Built on Morse Micro’s MM8108 system-on-chip, the module is now cleared for mass-market production, giving IoT device makers a validated path to Wi-Fi HaLow at scale.

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August 4, 2026

Posted by: Marion Webber

A man sitting with headphones on listening to something on his phone

SEALSQ and L5 Cartronics partner to develop secure multi-package IoT modules

SEALSQ, a developer of semiconductor, PKI and provisioning technologies, and L5 Cartronics (LFC), an Indian electronics design and manufacturing company, has announced a partnership to develop a new generation of highly competitive secure connectivity modules for IoT applications.

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July 21, 2026

Posted by: Marion Webber

2CoreSIM written on a blue background

Telefónica Deutschland and Crout launch Resilient Connectivity Solution

When monitoring cold chains, securing cash transports, transmitting vital data, or activating backup systems, the connection must never be interrupted. Telecommunications provider Telefónica Deutschland has gained a new partner for the Internet of Things in the German company Crout. Together, the companies are now launching the “2CoreSIM” on the market: an IoT solution that combines two independent network profiles on a single SIM card and automatically switches to the alternative connection in the event of disruptions.

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July 9, 2026

Posted by: Marion Webber