Device launched for advanced, smart and connected LED driver - IoT global network

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Device launched for advanced, smart and connected LED driver

March 12, 2019

Posted by: Anasia D'mello

The emerging trend of smart lighting in the Internet of Things (IoT), requires a new generation of LED drivers, says Infineon Technologies AG.

Now the company has introduced a new member of its XDP LED series, the XDPL8221 for cost-effective dual-stage drivers with advanced features. This device combines a quasi-resonant PFC and a quasi-resonant flyback controller with primary side regulation together with a communication interface.

A set of configurable protection mechanisms (standard and sophisticated) reportedly ensure safe, reliable and robust LED driver for a large set of use cases. The new driver IC will be showcased at the APEC 2019 exhibition in Anaheim, CA.

The XDPL8221 combines advanced functions, such as multi control featuring constant voltage, constant current and limited power as configurable operating parameters. The result is a versatile, high performance LED driver.

The performance of the XDPL8221 helps to design more efficient devices. This driver IC supports full functionality for both AC and DC input in the nominal input voltage range of 100 V AC to 277 V AC or 127 V DC to 430 V DC. Depending on the actual situation, the built-in digital control selects the best mode of operation. It can switch between quasi-resonant, discontinuous conduction or active burst modes.

The XDPL8221 UART interface with a command set enables control of the functions of the device and provides status information. This enables numerically exchanged real-time data. This data can be used for monitoring or additional local control functions.

The driver IC can be dimmed flicker free below one percent, while the current is still regulated with a high accuracy. The chip also offers a dim-to-off function to keep the device in a standby mode when the light is off with a low standby power (less than 100 mW, depending on driver design).

Reduced bill of materials (BOM) and increased flexibility are designed to minimise the overall system cost. The XDPL8221 comes in a DSO-16 package and, with a wide tool support, it is easy to design-in. This accelerates the design cycle and reportedly shortens time-to-market.

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